Jensen Huang predicts Nvidia chip sales volume will double next year as sovereign AI demand accelerates
Nvidia Chief Executive Officer Jensen Huang projected that the semiconductor giant will ship twice as many silicon units in the coming year compared to current volume. Speaking to reporters on the sidelines of a high-level AI summit convened by King Charles III at Dumfries House in Scotland, Huang attributed the aggressive unit expansion to global sovereign AI investments, expanding enterprise adoption, and the integration of artificial intelligence hardware across diverse industrial sectors.
Unit Projections Exceed Formal Financial Revenue Guidance
Huang’s comments provide an unusually direct unit-volume outlook that surpasses Nvidia’s official financial guidance. In its most recent quarterly earnings release, Nvidia projected approximately 70% revenue growth for fiscal year 2028. Although Nvidia Chief Financial Officer Colette Kress did note during last month's earnings call that total revenue could potentially double if supply chain bottlenecks were fully alleviated.
Addressing reporters in Scotland, Huang clarified that unit volume growth across all product tiers, from high-end data center accelerators to CPUs, networking chips, and edge processors, is on track to hit the 2x threshold:
"We expect to sell twice as many chips next year as we do this year. The reason for that is because AI is contributing so much to so many different industries and economies, and in almost every country that we're in, you could see that people want to invest in AI."
The comment covers Nvidia's entire silicon portfolio, spanning flagship Blackwell and upcoming Vera Rubin GPUs, Grace CPUs, optical networking chips, automotive platforms, and Jetson robotics processors.
Global Semiconductor Rally and HBM4 Memory Transition
The chief executive's bullish demand signals reverberated across international financial markets, triggering a broad rally in semiconductor equities. South Korea's KOSPI index jumped 2.66%, powered by substantial gains in key memory suppliers Samsung Electronics (+3.37%) and SK Hynix (+6.42%), while Taiwan's TAIEX rose nearly 900 points.
Industry analysts noted that doubling Nvidia's chip output will accelerate the broader memory market's structural transition to next-generation High Bandwidth Memory (HBM4 and HBM4E). To support Nvidia’s expanding roadmap, moving from Blackwell architecture (HBM3E) toward Vera Rubin systems, foundry partner TSMC is working to double its advanced Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity over the next two years.
